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Normal view MARC view ISBD view

Thermal management handbook for electronic assemblies

Sergent, Jerry

Thermal management handbook for electronic assemblies - New York, N.Y. : McGraw-Hill, 1998 - 338

Subjects--Topical Terms:
ELECTRONIC APPARATUS AND APPLIANCES--TEMPERATURE CONTROL
ELECTRONIC PACKAGING
MULTICHIP MODULES (MICROELECTRONICS)--DESIGN AND CONSTRUCTIO

LC Class. No.: TK7870.25 / S473T

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