Electronic assembly fabrication :  chips, circuit boards, packages, and components / 
Charles A. Harper editor-in-chief 
 - New York, N.Y. :  McGraw-Hill,  c2002 
 - 672 p. 
 - McGraw-Hill professional engineering Electronic packaging and interconnection series .
<br/><br/>Includes index 
<br/><br/><label>ISBN: </label>0071378820 
<br/><br/><label>Subjects--Topical Terms: </label><br/>ELECTRONIC APPARATUS AND APPLIANCES--DESIGN AND CONSTRUCTION
<br/><br/><label>LC Class. No.: </label>TK7870  / E432